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Rogers AD250C DK2.50 Df0.0013 (0.020-0.060") Antenna Grade Laminate
Brief Introduction
The AD Series antenna materials from Rogers Corporation are high-performance, specialty glass-reinforced PTFE-based laminates engineered for wireless antenna markets. AD250C provides controlled dielectric constant, low loss, and excellent PIM performance, making it ideal for reliable, high-yield printed circuit board fabrication.
Technical Features & Benefits
Glass-reinforced PTFE composite for good processability
Controlled dielectric constant for consistent impedance (Dk 2.50)
Very low loss (Df 0.0013 @ 10 GHz)
Excellent Passive Intermodulation (PIM) performance
Very low moisture absorption (<0.04%)
Very high copper peel strength (>14 lbs/in)
Available with standard ED or reverse-treated ED copper foil options
Typical Properties: AD250C
| Properties |
Typical Value |
Units |
Test Conditions |
Test Method |
| Electrical Properties | | | | |
| Dielectric Constant (process) | 2.50 | - | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Dissipation Factor | 0.0013 | - | 23°C @ 50% RH, 10 GHz | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dk | -117 | ppm/°C | 0 to 100°C, 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 4.8 x 10⁸ | MΩ·cm | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 4.1 x 10⁷ | MΩ | C96/35/90 | IPC TM-650 2.5.17.1 |
| Electrical Strength | 979 | V/mil | - | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | >40 | kV | D-48/50, X/Y direction | IPC TM-650 2.5.6 |
| PIM | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz | Rogers Internal 50 ohm |
| Thermal Properties | | | | |
| Decomposition Temperature (Td) | >500 | °C | 2hrs @ 105°C, 5% Weight Loss | IPC TM-650 2.3.40 |
| CTE - x | 47 | ppm/°C | -55°C to 288°C | IPC TM-650 2.4.41 |
| CTE - y | 29 | ppm/°C | -55°C to 288°C | IPC TM-650 2.4.41 |
| CTE - z | 196 | ppm/°C | -55°C to 288°C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.33 | W/(m·K) | z direction | ASTM D5470 |
| Time to Delamination | >60 | minutes | as-received, 288°C | IPC TM-650 2.4.24.1 |
| Mechanical Properties | | | | |
| Copper Peel Strength | 2.6 (14.8) | N/mm (lbs/in) | 10s @ 288°C, 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD/CMD) | 60.7/44.1 (8.8/6.4) | MPa (ksi) | 25°C ± 3°C | ASTM D790 |
| Tensile Strength (MD, CMD) | 41.4/38.6 (6.0/5.6) | MPa (ksi) | 23°C @ 50% RH | ASTM D3039 |
| Flex Modulus | 6,102/5,364 (885/778) | MPa (ksi) | 25°C ± 3°C | IPC-TM-650 2.4.4 |
| Physical Properties | | | | |
| Flammability | V-0 | - | - | UL 94 |
| Moisture Absorption | 0.04 | % | E1/105 + D48/50 | IPC TM-650 2.6.2.1 |
| Density | 2.28 | g/cm³ | C24/23/50 | ASTM D792 |
| Specific Heat Capacity | 0.813 | J/g·°K | 2 hours at 105°C | ASTM E2716 |
Application Areas
Specifically engineered for today's wireless antenna markets. Ideal for antenna applications requiring high performance, low loss, and excellent PIM characteristics including:
Base Station Antennas
Passive Components
Feed Networks
RF Identification Tags
Available Configurations
Standard Thicknesses:
0.020" (0.508 mm) +/- 0.002"
0.030" (0.762 mm) +/- 0.002"
0.060" (1.524 mm) +/- 0.003"
Standard Panel Sizes:
For 0.020": 18" x 12" (457mm x 305mm), 18" x 24" (457mm x 610mm)
For other thicknesses: 12" x 18" (305 x 457 mm), 24" x 18" (610 x 457 mm)
Standard Claddings:
Electrodeposited Copper Foil: ½ oz. (18µm), 1 oz. (35µm)
Reverse Treated ED Copper Foil: ½ oz. (18µm), 1 oz. (35µm)
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